MediaTek is set to announce its most advanced SoC yet, Dimensity 9000 at its Summit conference in the next few days. It will be World’s first-ever TSMC 4nm chipset for 5G devices. It will also be the first to feature a Cortex-X2 core clocking at up to 3.05 GHz and comes with Bluetooth 5.3. Keep reading to know all about what could be the groundbreaking 5G chip for smartphones in the coming year.
The highly efficient sub-6GHz 5G chipset will boost the performance of 5G smartphones while improving battery performance too.
MediaTek 9000 Features 1+3+4 Setup, Supports speeds up to 7500 Mbps
The top-tier SOC is structured comprises an advanced 1+3+4 setup. Its single “Ultra Core” Cortex-X2 rocks at 3.05 GHz. The 2 super cores, cortex-A710 clock at 2.85 GHz. Meanwhile, the 4 Cortex A510 cores will max at 1.8 GHz.
The SoC comes with LPDDR5x5 TAM speeds of up to 7500 Mbps in smartphones and has 14 MB of cache. MediaTek says it improves performance by 7% and bandwidth improvement by 25% against 8 MB of cache.
MediaTek 9000 will be mated to Mali-G710 with 10 cores. The raytracing SDK will allow developers to bring closer to PC-level graphic performance.
Smartphones will see the latest Bluetooth 5.3 with improvements. It will also support the next-gen WiFi 6E 2×2. Besides, Bluetooth Audio LE-ready, Dual-Link True Wireless Stereo Audio, Beidou III-B1C GNSS standard feature MediaTek’s greatest SoC to date.
There are improvements in the camera department too. The Dimensity 9000 will allow the camera to shoot video at 4K HDR from three cameras simultaneously. MediaTek says this is possible with the new ISP (Image Signal Processor) optimization.