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MediaTek Unveils Dimensity 8000 Series for 5G Phones

Taiwanese semiconductor company Mediatek has announced Dimensity 8000 Series at MWC 2022. The company has already become the largest supplier of smartphone SoCs to the US. And with this SoC, the company expects to drive its success further across the globe.

The latest 5G System-on-a-chip (SoC) consists of Dimensity 8000 and Dimensity 8100. Unlike its elder sibling Dimensity 9000 which came with a 4nm process, the 8000 Series are built using a 5nm process. However, its octa-core SoCs pack enough punch to fit into a flagship status.

Talking about those octa-cores, they consist of Arm’s 4 rock-solid performance-oriented Cortex-A78. It enables a maximum speed of 2.75 GHz for the 8000 SoC. Likewise, its senior chipset 8100 maxes out at 2.85 GHz. The remaining 4 cores are optimized for battery performance to allow devices to retain more even under heavy strenuous load.

Meanwhile, in the graphics department, the 8000 Series has a Mali-G610 integrated GPU. And if it needed more proof, it supports LPDDR5 RAM to deliver a convincing performance like any expensive flagship chipset.

Also read: Qualcomm Unveils FastConnect 7800, and X70 5G Modem

Dimensity 8000 Series for a decent gaming performance

Coming with a commendable clock speed, and a decent GPU, Mediatek understandably touts it for gaming. The company claims it can offer smooth graphics for high-end games. According to it, the 8100 can deliver 170fps and 8000 140fps. However, the company has not elaborated further on this aspect. But it goes without saying that the Series is versatile enough for gaming, to other high-end businesses.

The chipsets are also optimized for less energy consumption. The technology called ‘HyperEngine’ improves battery efficiency for the device it is powering. These lead to a conjecture that Dimensity 8000 Series will be good enough to support high-end gaming. But in the lack of enough details, no more has come out on this segment yet.

Also read: Qualcomm Unveils FastConnect 7800, and X70 5G Modem

200 MP shooter, 4K recording

Optics is another flex for smartphones these days, a marker of a leap in innovation. And the Dimensity 8000 Series does pack the specs. both the chips support up to 200 MP shooters. What is more astounding though is the five gigapixel-per-second (ISP) that enables high-quality HDR shots quickly.

To the video recording, no surprise Dimensity 8000 and 8100 can shoot extra detail-rich 4K videos at 60fps. That is at the highest setting possible at the moment. Besides, there are more common AI and noise-cancellation features for the photogenic.

MediaTek Dimensity 8000 Series
Courtesy: MediaTek

It is not the most premium SoC though and won’t stand up to Snapdragon 8 Gen 1. MediaTek Dimensity 8000 Series is a toned-down subordinate that will rather compete with Snapdragon 888 and fit for slightly cheaper 5G devices.

MediaTek SoCs are finally evolving after a long struggle to keep pace with others. However, the roads are still full of bumps for it. But the latest success with its products and business will motivate the Taiwanese company.

MediaTek 8000 Key Specifications

SpecificationDimensity 8000Dimensity 8100
CPU4x Arm Cortex-A78 @ up to 2.75GHz4x Arm Cortex-A55 @ up to 2.0GHz4x Arm Cortex-A78 @ up to 2.85GHz4x Arm Cortex-A55 @ up to 2.0GHz
GPUArm Mali-G610 MC6Arm Mali-G610 MC6
DisplayMaximum On-Device Display support: FHD+ @168HzMaximum On-Device Display support: FHD+ @ 168Hz / WQHD+ @ 120Hz
AI5th Gen APU 5805th Gen APU 580
MemoryLPDDR5Max frequency: 6400MbpsLPDDR5Max frequency: 6400Mbps
ISPImagiq 780 ISPSimultaneous dual-camera HDR video recordingMax camera sensor supported: 200MPMax video capture resolution: 4K (3840 x 2160)Camera features: 5Gbps 14-bit HDR-ISPs/Video HDR/Video Bokeh/Video EIS/AI-Shutter/AI-AE/AI-AF/AI-AWB/AI-NR HDR/AI-HDR/AI-FDImagiq 780 ISPSimultaneous dual camera HDR video recordingMax camera sensor supported: 200MPMax video capture resolution: 4K (3840 x 2160)Camera features: 5Gbps 14-bit HDR-ISPs/Video HDR/Video Bokeh/Video EIS/AI-Shutter/AI-AE/AI-AF/AI-AWB/AI-NR HDR/AI-HDR/AI-FD
Modem3GPP Release-16 5G modem5G/4G Dual SIM Dual Standby, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 2CC, 200MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallbackPeak downlink: 4.7Gbps2CC Carrier Aggregation (200MHz)MediaTek 5G UltraSave 2.03GPP Release-16 5G modem5G/4G Dual SIM Dual Standby, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 2CC, 200MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallbackPeak downlink: 4.7Gbps2CC Carrier Aggregation (200MHz)MediaTek 5G UltraSave 2.0
ConnectivityBluetooth 5.3Bluetooth LE Audio technology with Dual-Link True Wireless Stereo AudioWi-Fi 6E 2×2 (BW80)Beidou III-B1C signal supportBluetooth 5.3Bluetooth LE Audio technology with Dual-Link True Wireless Stereo AudioWi-Fi 6E 2×2 (BW80)Beidou III-B1C signal support
Manufacturing processTSMC N5 (5nm-class) production processTSMC N5 (5nm-class) production process
Courtesy: XDA

Launching Date

Dimensity 8000 Series will power mid-range to premium handsets. The company believes the device with the 8000 SoC could arrive as early as in the next few weeks. And again, it won’t be exclusive to China rather will be used globally by various smartphone OEMs.

Do you own a device that rocks on a MediaTek chipset from underneath? How do you rate its performance? Do share your feedback in our comments section below.

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